• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices all the devices being of a type provided for in the same subgroup of groups , or in a single subclass of , , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Patent holdings for IPC class H01L 25/065

Total number of patents in this class: 14456

10-year publication summary

998
1148
1249
1315
1416
1454
1550
1641
1816
761
2015 2016 2017 2018 2019 2020 2021 2022 2023 2024

Principal owners for this class

Owner
All patents
This class
Taiwan Semiconductor Manufacturing Company, Ltd.
36809
2383
Samsung Electronics Co., Ltd.
131630
1495
Intel Corporation
45621
1189
Micron Technology, Inc.
24960
842
SK Hynix Inc.
11030
357
Kioxia Corporation
9847
312
Qualcomm Incorporated
76576
252
International Business Machines Corporation
60644
248
Invensas Corporation
645
235
Sandisk Technologies LLC
5684
181
Advanced Semiconductor Engineering, Inc.
1546
168
Murata Manufacturing Co., Ltd.
22355
148
STATS ChipPAC Pte. Lte.
1516
143
Yangtze Memory Technologies Co., Ltd.
1940
129
Infineon Technologies AG
8189
122
Xilinx, Inc.
4086
122
Nanya Technology Corporation
2000
117
Renesas Electronics Corporation
6305
116
Mediatek Inc.
4584
113
Sony Semiconductor Solutions Corporation
8770
110
Other owners 5674